TiECON 2013 Preview & Insight; Discount for IEEE Members
Introduction:
TiECon is the world’s largest conference for entreprenneurs. Held each year in Santa Clara, CA, the conference is an exciting, high energy event. TiEcon 2013 will cover the hottest technology topics delivered by brilliant experts. The 2013 conference will devote Friday May 17th entirely to three high-growth tracks – Mobility, Big Data and Software Defined Infrastructure (SDI). Saturday May 18th will be entirely devoted to entreprenneurship and mentoring. Attendees can expect the usual high-impact networking opportunities in the Expo Hall and during lunch and cocktail receptions – that have launched many a successful startup or a blazing career opportunity.
Information about the TiECON program is at:
Insight and Perspective:
TiE-Silicon Valley President Venk Shukla told me that this year’s TiECon is a fundamental change from previous years programs. There is a distinct and separate focus for Friday and Saturday as noted above.
1. Those interested in keeping up with the latest technology trends and professional growth can chose pick and chose from Friday sessions on Mobility, Big Data and SDI. Here the cutting edge market and technology trends from top companies in each field while networking with colleagues and friends. 30 minute panel sessions will provide a birds-eye view (high level overview) of the topic and subject matter being addressed.
2. Attendees interested in entreprenneurship, mentoring, social skills, and personal growth should attend on Saturday. There will be a Youth Forum and Womens Forum also held on Saturday.
Of course, those interested in both professional and personal advancement can attend on both days.
-Once registered for the conference, you can participate in a “find your co-founder” session on Friday or Saturday at 6pm. You get to talk for 3 minutes about what type of individual you’d like to be a co-founder of your embryonic start-up.
-The very popular “mentor connect” program at TiECon has been reformatted. Attendees will now be able to pick which mentor(s) they want to spend time with.
Procedure: After registering for the conference, the attendee should indicate interest in the Mentor Connect program. They are then sent a url which contains profiles of the various mentors that will be available.ft
After selecting the mentor(s) they’d like to spend time with, the attendee meets up with the mentor(s) at a networking lunch on Saturday.
More details at: http://tiecon.org/content/mentor-connect-and-networking-lunch
TiEcon 2013 Highlight Speakers:
• Jeff Weiner – CEO, LinkedIn
• Anand Chandrasekhar – CMO, Qualcomm
• Boyd Davis – GM, Intel Datacenter Software Division
• Chris Anderson – CEO 3D Robotics and former editor in chief, Wired magazine
• Rayid Ghani – Chief Scientist, Obama campaign,
• D. J. Patil – Formerly Chief Data Scientist, LinkedIn
• Ashish Thakkar – Founder, Mara Group
• Maya Strelar-Migotti – Vice President, Ericsson SV
• Ronnie Screwvala – Director, Disney-UTV
• Manoj Bhargava – Founder and CEO, 5-hour Energy
• Bharat Desai – Chairman and Co-Founder, Syntel
• Jeff Weiner – CEO, LinkedIn
• Anand Chandrasekhar – CMO, Qualcomm
• Boyd Davis – GM, Intel Datacenter Software Division
• Chris Anderson – CEO 3D Robotics and former editor in chief, Wired magazine
• Rayid Ghani – Chief Scientist, Obama campaign,
• D. J. Patil – Formerly Chief Data Scientist, LinkedIn
• Ashish Thakkar – Founder, Mara Group
• Maya Strelar-Migotti – Vice President, Ericsson SV
• Ronnie Screwvala – Director, Disney-UTV
• Manoj Bhargava – Founder and CEO, 5-hour Energy
• Bharat Desai – Chairman and Co-Founder, Syntel
IEEE Member Discount
IEEE members can get a $70 discount for 2-day registration till the end of April. If you are an IEEE member that would like to attend, please email me ([email protected]) for the IEEE member discount code. Please include your IEEE member number for validation. Thanks, alan
References: 2012 TiECON
Here is the story I did on last year’s TiECon about India’s Father of Telecom- Sam Pitroda
A slightly different version of that article was published in IEEE GCN- print and on line editions:
TiECON 2012 Mobile Sessions: