Highlights of ISQED Conference: March 14-15, 2017 Santa Clara, CA
ISQED Conference Backgrounder:
The 18th International Symposium on Quality Electronic Design (ISQED 2017) is the premier interdisciplinary and multidisciplinary Electronic Design conference—bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools, integrated circuit technologies, semiconductor technology,packaging, assembly & test to achieve total design quality.
The ISQED 2017 event is held with the technical sponsorship of IEEE CASS, IEEE EDS, and IEEE Reliability Society.
Highlights of Two Sessions:
1. Terrific panel session on Cybersecurity Challenges for the Automotive Industry at the ISQED conference on Tuesday March 14th.
Abstract: In the past couple of years, we have witnessed one of the most dramatic transformations in automotive industry: vehicles are becoming intelligent and connected. They are not only a tool controlled by the so-called “drivers” to transport people and goods from one place to another. They are “talking” to each other as well as roadside infrastructure, making themselves autonomous or “driverless”. In this panel, we have invited experts to share their views on cybersecurity challenges such as safety, security, and privacy that the automotive industry are facing. Our panelists will also discuss how our life will be changed (again) by the next generation vehicles.
Chair & Moderator:
Professor Gang Qu – University of Maryland
Panelists:
Anuja Sonalker – STEER Tech
Gaurav Bansal – Toyota InfoTechnology Center
Navraj Nandra – Senior Director of Interface IP – Synopsys
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2. Session on Design for Smart Sensors and Internet of Things (IoT): Low Power MEMS based Sensors
Author’s Notes:
In an enlightening and stimulating presentation on Low Power MEMS based Sensors, David Horsley, PhD described his research in this field along with commercially available piezo-electronics MEMS based sensors from ST Micro, Avago, and Vesper. He noted that low cost, low power and small footprint size sensors are needed for many IoT applications.
Another very real application of ultrasonic sensors (in a matrix configuration) is a fingerprint reader (and validator) for a smart phone. That would eliminate the need for a password to unlock the phone. Current ultra sonic sensors are too big for that application and also require a lot of external electronics.
David is the CTO of Chirp Microsystems which designs, develops, and manufactures a line of extremely low power, ultrasonic 3D-sensing solutions for consumer electronics, smart homes, industrial automation, and much more. Chirp’s technology was originally developed at the Berkeley Sensor and Actuator Center (BSAC) at UC Berkeley and UC Davis. Horsley showed the audience various functional block diagrams of those sensors used in the fingerprint reader application. The company says that their technology is an enabler for high volume, pervasive computing applications for the Internet of Things (IoT).
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