Broadcom Inc. today announced the availability of its 5nm 100G/lane optical PAM-4 DSP PHY with integrated transimpedance amplifier (TIA) and laser driver, the BCM85812, optimized for 800G DR8, 2x400G FR4 and 800G Active Optical Cable (AOC) [1.] module applications. Built on Broadcom’s proven 5nm 112G PAM-4 DSP platform, this fully integrated DSP PHY delivers superior performance and efficiency and drives the overall system power down to unprecedented levels for hyperscale data center and cloud providers.
Note 1. Active Optical Cable (AOC) is a cabling technology that accepts same electrical inputs as a traditional copper cable, but uses optical fiber “between the connectors.” AOC uses electrical-to-optical conversion on the cable ends to improve speed and distance performance of the cable without sacrificing compatibility with standard electrical interfaces.
BCM85812 Product Highlights:
- Monolithic 5nm 800G PAM-4 PHY with integrated TIA and high-swing laser driver
- Delivers best-in-class module performance in BER and power consumption.
- Drives down 800G module power for SMF solutions to sub 11W and MMF solutions to sub 10W.
- Compliant to all applicable IEEE and OIF standards, capable of supporting MR links on the chip to module interface.
- Fully compliant with OIF 3.2T Co-Packaged Optical Module Specs
- Capable of supporting optical modules from 800G to 3.2T
Demo Showcases at OFC 2023:
Broadcom will demonstrate the BCM85812 in an end-to-end link connecting two Tomahawk 5 (TH5) switches using Eoptolink’s 800G DR8 optical modules. Attendees will see live traffic stream of 800GbE data running between two TH5 switches. Broadcom will showcase various 800G DR8, 2x400G FR4, 2x400G DR4, 800G SR8, and 800G AOC solutions from third party transceiver vendors that interoperate with each other, all using Broadcom’s DSP solutions. Following are module vendors that will be participating in a multi-vendor interop plug-fest on the latest Tomahawk 5 switch platform: Eoptolink, Intel, Molex, Innolight, Source Photonics, Cloud Light Technology Limited and Hisense Broadband.
Additionally, Broadcom in collaboration with Semtech and Keysight will demonstrate a 200G per lane (200G/lane) optical transmission link leveraging Broadcom’s latest SerDes, DSP and laser technology. These demonstrations will be in Broadcom Booth 6425 at the Optical Fiber Communication (OFC) 2023 exhibition in San Diego, California from March 7th to 9th.
“This first-to-market highly integrated 5nm 100G/lane DSP PHY extends Broadcom’s optical PHY leadership and demonstrates our commitment to addressing the stringent low power requirements from hyperscale data center and cloud providers,” said Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom. “With our advancement in 200G/lane, Broadcom continues to lead the industry in developing next generation solutions for 51.2T and 102.T switch platforms.”
“By 2028, optical transceivers are projected to account for up to 8% of total power consumption in cloud data centers,” said Bob Wheeler, principal analyst at Wheeler’s Network. “The integration of TIA and driver functions in DSP PHYs is an important step in reducing this energy consumption, and Broadcom is leading the innovation charge in next-generation 51.2T cloud switching platforms while also demonstrating a strong commitment to Capex savings.”
Broadcom has begun shipping samples of the BCM85812 to its early access customers and partners. Please contact your local Broadcom sales representative for samples and pricing.
Separately, Semtech Corp. with Broadcom will demonstrate a 200G per lane optical transmission link that leverages Semtech’s latest FiberEdge 200G PAM4 PMDs and Broadcom’s latest DSP PHY. The two companies plan to recreate the demonstration this week at OFC 2023 in San Diego in their respective booths. Such a capability will be useful to enable 3.2-Tbps optical modules to support 51.2- and 102.4-Tbps switch platforms, Semtech points out.
The two demonstrations will leverage Semtech’s FiberEdge 200G PAM4 EML driver and TIA and Broadcom’s 5-nm 112-Gbaud PAM4 DSP platform. Instrumentation from Keysight Technologies Inc. will verify the performance of the links.
“We are very excited to collaborate with Broadcom and Keysight in this joint demonstration that showcases Semtech’s 200G PMDs and their interoperability with Broadcom’s cutting-edge 200G/lane DSP and Keysight’s latest 200G equipment,” said Nicola Bramante, senior product line manager for Semtech’s Signal Integrity Products Group. “The demonstration proves the performance of a 200G/lane ecosystem, paving the way for the deployment of next-generation terabit optical transceivers in data centers.”
“This collaboration with Semtech and Keysight, two of the primary ecosystem enablers, is key to the next generation of optical modules that will deliver increased bandwidth in hyperscale cloud networks. This achievement demonstrates our commitment to pushing the boundaries of high-speed connectivity, and we are excited to continue working with industry leaders to drive innovation and deliver cutting-edge solutions to our customers,” added Khushrow Machhi, senior director of marketing of the Physical Layer Products Division at Broadcom.
“Semtech’s and Broadcom’s successful demonstration of the 200-Gbps optical link is another important milestone for the industry towards ubiquitous future 800G and 1.6T networks. Keysight’s early engagement with leading customers and continuous investments in technology and tools deliver the needed insights that enable these milestones,” said Dr. Joachim Peerlings, vice president and general manager of Keysight’s Network and Data Center Solutions Group.
Broadcom Inc. is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, enterprise software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise, mainframe and cyber security software focused on automation, monitoring and security, smartphone components, telecoms and factory automation. For more information, go to https://www.broadcom.com.
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