Ranovus Inc. (“RANOVUS”) [1.] has announced the availability of its protocol-agnostic Odin™ 100G optical I/O cores based on GF Fotonix™, GlobalFoundries’ recently announced next generation, monolithic platform. GF Fotonix™ is the first in the industry to combine its differentiated 300mm photonics and RF-CMOS features on a silicon wafer, delivering best-in-class performance at scale. The announcement was made at OFC 2023 in San Diego.
Note 1. RANOVUS, founded in 2012, develops and manufactures advanced photonics interconnect solutions to support the next generation of AI/ML workloads in data centers and communication networks. Its current portfolio includes Multi-Wavelength Quantum Dot Laser technology and advanced digital and silicon photonics integrated circuit technologies that set a new industry benchmark for the lowest power dissipation, size, and cost for the next generation of optical interconnect solutions. RANOVUS’ Odin™ platform is claimed to be the enabling technology for a new data center architecture optimized for AI/ML workloads.
Odin 100G optical I/O chiplets and IP cores can be integrated with processors, switches, and memory appliances to enable new data centre architectures for machine learning, artificial intelligence, metaverse, cloud, 5G communications, and defence and aerospace. Data centres are increasingly demanding efficient and cost-effective high-capacity interconnect solutions to meet the exponential growth in data-driven applications like ML/AI and metaverse. Odin 100Gbps optical I/O scales from 8- to 32-cores in the same footprint by combining RANOVUS’ 100G bps per wavelength monolithic EPIC (Electro-Photonic Integrated Circuit) cores with its proprietary laser and advanced packaging technologies.
“We are delighted to share our multi-disciplinary silicon-photonics IP cores and chiplets, and advanced packaging solutions with our customers who are driving the adoption of novel data centre architectures based on integrating best-in-class chiplets and co-packaged optics”, said Hojjat Salemi, Chief Business Development Officer of RANOVUS. “Our close collaboration with GlobalFoundries underlines our joint commitment to deliver a fully featured set of qualified IP cores and chiplets with OSAT-ready high-volume manufacturing flows and supporting ecosystem to enable the huge potential of monolithic silicon photonics.”
As previously announced, RANOVUS has developed a highly flexible co-packaged optics architecture (Analog-Drive CPO 2.0) together with a Tier 1 ecosystem for high volume manufacturing of Odin chiplets. The first customer co-packaged solution with 800Gbps Odin optical I/O is also being demonstrated at OFC 2022 with samples based on the GF Fotonix platform shipping now.
“Data centers, computing and sensing applications require incredible processing, transmission and power efficiency as the world’s data needs soar dramatically.” Ranovus’ IP cores, chiplets and advanced packaging solutions, combined with GF Fotonix, provide customers a complete solution to develop the chips needed solve some of the biggest challenges facing data centers today,” commented Anthony Yu, vice president, Computing and Wired Infrastructure Strategic Business Unit at GF.
Image Credit: RANOVOUS
Previously at OFC 2023, RANOVUS announced interoperability of AMD Versal adaptive SoCs with the co-packaged Odin® 800G direct-drive optical engine and third party 800G DR8+ retimed pluggable modules. The interoperability demonstration is part of OFC 2023, the leading optical networking event in North America, and highlights the versatility of RANOVUS’s Odin® portfolio for AI/ML and communications applications.
“We announced the first generation of our Odin® optical interconnect at OFC 2022 for proprietary AI/ML applications. We are thrilled to showcase our standards-based Odin® optical interconnect product with 5pJ/bit for a direct-drive CPO solution,” said Dr. Christoph Schulien, head of Systems and High-Speed IC R&D of RANOVUS. “Its inherent versatility enables hyperscale data center providers to drastically reduce power consumption and optimize density and cost as they deploy novel hybrid data center architectures in response to the insatiable growth in AI/ML workloads.”
“RANOVUS’ demonstration of interoperability between our Versal™ adaptive SoCs co-packaged with Odin® 800G direct-drive CPO 2.0 and third party 800G DR8+ retimed pluggable modules underlines the flexibility and scalability of RANOVUS’ technology,” said Yohan Frans, vice president, Engineering at AMD. “We are proud of our collaboration with RANOVUS in demonstrating the performance and versatility of monolithic silicon photonics interconnects as data center and 5G customers deploy highly efficient and cost-effective systems for next generation workloads.”
“RANOVUS’ demonstration of interoperability between CPO and pluggable modules is a key proof point that their interconnect technology supports the flexibility and scalability with the lowest power consumption sought by hyperscalers as they optimize their data centers for AI/ML workloads,” said Vladimir Kozlov the founder and CEO of LIGHT COUNTING.
RANOVUS, with operations in Ottawa, Canada (headquarters), Nuremberg, Germany and Sunnyvale, CA, develops and manufactures advanced photonics interconnect solutions to support the next generation of AI/ML workloads in data centers and communication networks. Our team has extensive experience in product development and commercialization of optoelectronics subsystems for the information technology industry. RANOVUS’ current disruptive portfolio of IP cores includes multi-wavelength quantum dot laser technology and advanced digital and silicon photonics integrated circuit technologies that set a new industry benchmark for the lowest power dissipation, size, and cost for the next generation of optical interconnect solutions. RANOVUS’ Odin™ platform is the enabling technology for a new data center architecture optimized for AI/ML, metaverse, cloud and 5G communications workloads. The company has received funding from leading venture capital firms, strategic investors, Sustainable Development Technology Canada, and Strategic Innovation Fund of Canada.