Ericsson and MediaTek set new 5G uplink speed record using Uplink Carrier Aggregation

Ericsson and MediaTek have set a new 5G uplink speed record of 440 Mbps in low-band and mid-band spectrum using Uplink Carrier Aggregation. That uplink speed was achieved in an Ericsson lab. The test was performed with Ericsson’s Radio Access Network (RAN) Compute Baseband 6648 and a mobile device using a MediaTek Dimensity 9200 flagship 5G smartphone chipset.

More precisely, the combination used was 50MHz FDD n1 and 100MHz TDD n77. By aggregating these two bands, communications service providers can considerably increase their uplink speeds, resulting in better network performance and user experience.  The fast uplink speed brings better, smoother experiences for the likes of video conference users, streamers, and their audience with more frames per second and higher image resolution.  The 440 Mbps 5G upload speed achieved in the lab compares to an average of 26.78 Mbps outdoors and 22.98 Mbps indoors, as per a Cellsmart survey.

Sibel Tombaz, Head of Product Line 5G RAN, Ericsson, said: ”Super-fast uplink speeds make a big difference in the user experience. From lag-free live streaming, video conferencing and AR/VR apps, to more immersive gaming and extended reality (XR) technologies.  The 440 Mbps upload speed achieved by Ericsson and MediaTek will help make that difference. We are also continuously designing innovative solutions for optimizing 5G networks so our customers can make the best use of their spectrum assets.”

Service providers are seeking innovative ways of boosting capacity while using existing spectrum efficiently to meet growing demands for wireless data and applications. This is where carrier aggregation comes in, optimizing the service provider’s spectrum assets to bring to users better coverage, increased capacity, and higher data speeds.

HC Hwang, General Manager of Wireless Communication System and Partnership at MediaTek, said: “The successful result of combining Ericsson’s state-of-the-art 5G Baseband and MediaTek’s flagship smartphone chip has achieved another 5G industry milestone, and paves the way for superior mobile experiences to benefit users every day.” Uplink speed is becoming more crucial with the expected uptake of

gaming, XR, and video-based apps. For example, as AR devices gain popularity with larger augmentation objects, rendering becomes more demanding. This increases the demand on networks to deliver higher throughput and lower latency.

Uplink speed is becoming more crucial with the expected uptake of gaming, XR, and video-based apps. For example, as AR devices gain popularity with larger augmentation objects, rendering becomes more demanding. This increases the demand on networks to deliver higher throughput and lower latency.

Earlier this year, AT&T boasted that it had completed what was believed to be the first 5G standalone (SA) uplink 2-carrier aggregation data connection in the U.S.

The connection was made at its Redmond, Washington, lab, where they achieved upload speeds of over 120 Mbps with a combination of 850 MHz and 3.7 GHz spectrum.

In May, T-Mobile reported reaching uplink speeds over 200 Mbps in a 5G data call using uplink CA; in that case, they used T-Mobile’s live commercial 5G SA network as opposed to a lab environment. T-Mobile used 2.5 GHz and 1.9 GHz bands.


CELLSMART: 5G upload speeds are insufficient for industrial/enterprise applications

Cellsmart: 5G download performance improves but upload performance lags

MediaTek Introduces Global Ecosystem of Wi-Fi 7 Products at CES 2023

Taiwan based MediaTek, one of the first adopters of Wi-Fi 7 [1.] technology, will be demonstrating a full ecosystem of production-ready devices featuring the next generation of wireless connectivity for the first time at CES 2023. These products are the culmination of MediaTek’s investment in Wi-Fi 7 technology, focusing on reliable and always-on connected experiences on a wide variety of devices in several product categories, including residential gateways, mesh routers, televisions, streaming devices, smartphones, tablets, laptops, and more.

Note 1.  Wi-Fi 7 refers to the IEEE 802.11be standard, whereas Wi-Fi 6 was IEEE 802.11ax, and Wi-Fi 5 was IEEE 802.11ac.

As the most current and powerful Wi-Fi standard, Wi-Fi 7 (IEEE 802.11be) utilizes record-breaking 320MHz channel bandwidth and 4096-QAM modulation to greatly improve overall user experience. Multi-Link Operation (MLO) also enables the Wi-Fi connection to aggregate channel speeds and alleviate link interruption in congested environment for time-demanding applications.

“Last year, we gave the world’s first Wi-Fi 7 technology demonstration, and we are honored to now show the significant progress we have made in building a more complete ecosystem of products,” said Alan Hsu, corporate vice president and general manager of the Intelligent Connectivity Business unit at MediaTek. “This lineup of devices, many of which are powered by the CES 2023 Innovation Award-winning Filogic 880 flagship chipset, illustrates our commitment to providing the best wireless connectivity.”

Using a 6nm process, MediaTek’s Wi-Fi 7 solution offers a reduction in main power consumption by 50% and 100x lower MLO switch latency when compared to competing options. 4T5R and penta-band mesh are also included to address a larger area of coverage and higher number of linked devices.

The devices on demonstration this week utilize MediaTek’s latest Filogic chips, which combines a Wi-Fi 7 access point technology to broadband operators, retail router channels and enterprise markets; and the Filogic 380 chipset, designed to bring Wi-Fi 7 connectivity to all client devices, including smartphone, tablet, laptops, TVs, and streaming devices.

“We are excited to collaborate with MediaTek on the latest Wi-Fi 7 technology.  Fast and reliable wireless connectivity is crucial for consumers, and we believe that combining powerful AMD Ryzen processors with MediaTek’s advanced connectivity technologies will deliver an excellent user experience,” said Jason Banta, corporate vice president and general manager, client OEM at AMD.

“A strong, fast, and reliable Wi-Fi connection is one of the most critical components of competitive gaming, and can mean the difference between winning and losing a match,” said Ouyang Jun, Vice President and General Manager of Consumer Business Segment, Lenovo’s Intelligent Device Group. “MediaTek’s vision for excellence in Wi-Fi connectivity mirrors our own commitment to empowering gamers with immersive, high-performance PC gaming experiences, and we look forward to collaborating together to bring MediaTek’s Wi-Fi 7 technology to upcoming Lenovo Legion devices.”

“We greatly enjoy MediaTek Filogic’s, fast, reliable and always-on connected Wi-Fi solution,” said Rangoon Chang, head of Gaming Business Unit, ASUS. “With MediaTek’s world leading Wi-Fi technology and innovative ecosystem, we strive for leadership in providing the extreme experience for gamers around the globe.”

“With the introduction of 320 MHz channels in the 6 GHz band and Multi-Link Operation (MLO), Wi-Fi 7 will deliver ultra-high speed and lower latency,” said Pingji Li, VP & GM, TP-Link Corporation Limited. “MediaTek Filogic 880’s innovative design delivers outstanding performance on top of Wi-Fi 7 standards, such as 4×5 6 GHz and single-chip MLO. We are excited to collaborate with our longtime partner, MediaTek, on Wi-Fi 7 to create new ways for customers to experience applications.”

“As a leader in networking products and services for more than 23 years, BUFFALO has always been among the first to implement new Wi-Fi technology, and Wi-Fi 7 is no exception,” said Nobuhiro Tamura, General Manager, Network Product Development Division, BUFFALO INC. “We are glad to see MediaTek put a lot of investment in leading technology, and would like to congratulate them on showcasing the latest Wi-Fi 7 solutions at CES 2023.”

“Today’s consumers want fast, reliable and always-on connected Wi-Fi for many applications such as video calls, 4K/8K TV entertainment, real-time gaming, streaming and more,” said Byung-Kyun Kim, Senior Vice President, Korea Telecom. “MediaTek Wi-Fi 7 technology is equipped with extremely high throughput and single MAC MLO (Multi-Link Operation), which can fulfill every demanding application consumers enjoy today.”

“With MediaTek’s single chip MLO technology, we can bring high throughput and low latency performance to enhance user experience on streaming, gaming, and various immersive contents,” said Mr. Yu, SVP in Hisense Group. “Hisense is excited to continue the partnership with MediaTek to bring Wi-Fi 7 on Hisense TV products.”

“MediaTek recognizes the demand and expectation for the fastest speeds and lowest latency from wireless devices,” said John O’Neill, Vice President, Marketing, Skyworks. “Together, our joint reference design provides customers a platform to develop new and unimagined applications. We are excited to deliver cutting-edge technology together that allows consumers to realize the full potential of Wi-Fi 7 that supports 320 MHz channels, 4K QAM and Multi-Link Operation (MLO).”

“As a strong driver of Wi-Fi 7, MediaTek helps its customers harness the massive improvements in throughput, latency, client connections and reliability,” said Tony Testa, General Manager Connectivity Components, Qorvo. “We are excited to utilize MediaTek’s Wi-Fi 7 solution in order to tackle its impressive 4K QAM, 320 MHz, 6 GHz channels and Multi-Link Operation.”

“As companies move to Wi-Fi 7 it is critical that they be able to test the fastest available data rate modes, and we have worked with MediaTek to create an industry leading test solution that meets this vital need,” said John Lukez, Vice President LitePoint Applications, Litepoint. “As we head into this new era of wireless connectivity, working with a leading Wi-Fi innovator like MediaTek will enable our mutual customers to quickly and seamlessly ramp their products into high volume production.”

“We are truly impressed with MediaTek’s speed to market with almost every cutting-edge technology, such as single MAC MLO, 320MHz BW and 4096 QAM,” said Jesse Lyles, Vice President of Semiconductor Validation and Electronics Solutions, NI. “The increased amount of complexity needed to achieve top performance and backward compatibility with Wi-Fi 7 drastically increases the need for a full-scale automated test and validation solution.  NI works together with MediaTek with its software-connected RF instrumentation to achieve the time-to-market goals of mutual customers and to ensure their superior performance capabilities.”

To learn more about MediaTek’s Filogic portfolio, please visit:

About MediaTek Inc.

MediaTek Incorporated  is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit for more information.


MediaTek to expand chipset portfolio to include WiFi7, smart homes, STBs, telematics and IoT

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MediaTek to expand chipset portfolio to include WiFi7, smart homes, STBs, telematics and IoT

Taiwanese fabless chipmaker MediaTek is gearing up to expand its customer base beyond the increasingly saturated smartphone segment to include connected devices for smart homes, electric vehicle (EV) manufacturers and the smart retail field.

Chunyan See, Thailand country manager for MediaTek, said the company is offering chipsets beyond the smartphone segment to WiFi 7-linked products, set-top boxes (with video streaming so popular aren’t STBs a thing of the past?), telematics, and Internet of Things. Some market leaders and mobile operators plan to launch WiFi 7 products in the first quarter of 2023.  Mediatek previously announced chipsets for WiFi 6 and 6E.

“We see the gaps to change from WiFi 6 to WiFi 6E and WiFi 7 becoming shorter and shorter,” said Mr See. “Service operators typically take one to 1.5 years for internal testing to get the requirements finalized.”

Demand for higher wireless connection speed in Thailand is pushing local mobile operators to aggressively invest in 5G and fixed broadband services, he said. With rising inflation and a weaker baht, the overall smartphone market in Thailand will be tough this year, with the market size expected to drop to 19.2 million units, from 20-21 million last year, he said. In the second half of this year, 5G-enabled smartphones are expected to account for 40% of the total market, versus 32% in the first half and 24% in 2021, said Mr See.

MediaTek is also working with local partners beyond the smartphone segment in three fields — smart homes, smart retail, and smart logistics. For smart homes, the company will power the next generation of smart home accessories, including smart lighting and sensors. In smart retail, the firm supports smart point-of-sale devices that can cater for face payments, which is already the norm in China. Regarding smart logistics, 5G equipment powered by the firm’s chipsets can play a key role in telematics, which is a method of monitoring vehicles and other assets by using GPS technology, and can serve EVs. Chinlin Low, technical account manager for Asia-Pacific at MediaTek, said.

ASEAN (Association of Southeast Asian Nations) is expected see a compound annual growth rate (CAGR) of 83% for 5G subscriptions from 2021 to 2027, when they are forecast to reach 570 million.

Mobile data traffic per smartphone is expected to reach 45 gigabytes per month in 2027, up from 9.4GB in 2021, with a CAGR of 30%, driven by the rise of virtual and augmented reality services.

MediaTek has a broad range of chipsets to offer, including Dimensity 9000, 8100 and 8000 to cater for premium smartphones, he added.

Daniel Lin, MediaTek’s deputy director of corporate sales and emerging markets, said the company sees an opportunity to increase its share of the global premium smartphone segment. “MediaTek has a strong market share in smartphones costing between US$99 to $299, but the firm aims to increase its share in premium smartphones with the launch of new chipsets,” he said.

In 2021, the firm’s overall market share in the smartphone segment rose to 42%, from 32% in 2020. Its share in Android-powered handsets surpassed 50% in 2021, up from 38% in 2020.

MediaTek posted revenue of $17.6 billion in 2021, up from $10.9 billion a year earlier.


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