Broadcom with Samsung Electronics: Integrated 5G and Wi-Fi 8 FWA Platform

Broadcom has announced a collaboration with Samsung Electronics Co., Ltd. to develop a reference platform for fixed wireless access (FWA) deployments, combining Broadcom’s BCM6776 Wi-Fi system-on-chip (SoC) with Samsung’s B1320 5G modem. The platform is designed to integrate 3GPP Release 17 5G connectivity with emerging IEEE 802.11bn (Wi-Fi 8) capabilities, supporting convergence between wide-area and local-area broadband technologies.

The reference design targets global FWA use cases, where operators seek to deliver high-throughput broadband services using 5G radio access in conjunction with advanced in-home wireless distribution. By aligning 5G and Wi-Fi 8 performance characteristics, the platform addresses requirements for sustained throughput, low latency, and reliability under variable radio conditions. The design also emphasizes scalability for high-volume deployments, with integration intended to reduce system complexity and cost.

The Broadcom BCM6776 is a tri-band Wi-Fi 8 SoC designed for residential and small enterprise access points. It integrates a quad-core Arm-based network processor with Wi-Fi 8 radio functionality in a single device. The SoC supports 2-stream operation with 40 MHz channels in the 2.4 GHz band, and 4-stream operation with up to 160 MHz channels in the 5 GHz and 6 GHz bands. This configuration enables multi-gigabit aggregate throughput while maintaining compatibility with evolving IEEE 802.11bn features.

Integration of compute and radio subsystems within a single SoC reduces bill of materials (BOM) requirements and simplifies hardware design. Power efficiency is also improved relative to prior architectures that relied on discrete components, supporting deployment in thermally constrained residential environments.

Image Credit: Broadcom

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The Samsung B1320 modem is a 5 nm-class integrated 5G chipset compliant with 3GPP Release 17. It supports peak downlink throughput of up to 3.43 Gbps and uplink throughput of up to 1.17 Gbps, depending on deployment configuration. The modem incorporates a quad-core Arm CPU, RF transceiver, power management functions, and a global navigation satellite system (GNSS) receiver.

The platform further supports non-terrestrial network (NTN) operation, including both NR-NTN and NB-NTN modes, enabling compatibility with satellite-based extensions of 5G coverage.

The combined architecture is designed to sustain end-to-end throughput between the 5G access link and the in-home Wi-Fi network, minimizing bottlenecks between the wide-area and local domains. This is particularly relevant for FWA deployments, where performance is constrained by both radio access conditions and in-premises distribution efficiency.

By providing a pre-integrated reference design, the platform enables original equipment manufacturers (OEMs) and operators to accelerate development cycles and standardize system performance across deployments. This approach supports broader adoption of FWA as a complement to fixed broadband infrastructure, particularly in scenarios where fiber deployment is limited or economically constrained.

“At Computex 2026, we are highlighting that the future of home internet can be both accessible and affordable,” said Joonsuk Kim, Executive Vice President and Head of CP Development at Samsung Electronics. “This platform is designed to deliver reliable performance across a wide range of environments, helping operators bring high-quality connectivity experiences to subscribers.”

“Broadcom is proud to lead the Wi-Fi 8 transition alongside Samsung and our valued ODM partners,” said Vijay Nagarajan, Vice President of Marketing, Wireless and Broadband Communications Division at Broadcom. “This partnership is a game-changer for the FWA market. The combination of Wi-Fi 8 and 5G prioritizes coordinated reliability, giving operators a tool that delivers a consistent experience to every corner of the home.”

Product Features:

The Samsung B1320 is a broadband-optimized 5G platform with the following features:

  • 3GPP Release 17
  • 4Rx/2Tx radio chain support
  • Power Class 1.5 support (TDD bands)
  • LPDDR4x / LPDDR5x support
  • 1.6 GHz quad-core ARM Cortex-A55 CPU
  • 5 Gbps USXGMII, PCIe Gen 3, USB 2.0
  • GNSS
  • NR-NTN and NB-NTN support for n255 and n256 (L- and S-bands)

The Broadcom BCM6776 is a single-chip Wi-Fi SoC and multi-band radio supporting the following:

  • High performance quad-core CPU complex
  • Dedicated network processing engine freeing the CPU complex for operator-specific applications and utilities
  • Integrated 2×2 2.4 GHz and 4×4 5 GHz and 6 GHz Wi-Fi 8 MAC/PHY/Radio functionality, simplifying system design and lowering cost
  • On-chip 2.4 GHz power amplifiers (PAs) and support for third-generation digital pre-distortion for reduced external components and improved RF efficiency
  • Versatile memory controller supporting DDR4, LPDDR4, DDR5, and LPDDR5
  • Dual PCIe Gen3 controllers to enable simultaneous tri-band applications with a single additional chip
  • Integrated multi-gig PHY

A Global Ecosystem of Support:

The launch is supported by the world’s leading original equipment manufacturers (OEMs), who are already integrating the B1320 / BCM6776 platform into their next-generation gateway portfolios.

“HUMAX Networks is delighted to pioneer the next-generation 5G CPE market alongside global technology leaders Broadcom and Samsung. At the recent MWC 2026, we successfully showcased the industry’s first Wi-Fi 8 solution, which integrates Samsung’s cutting-edge 5G technology with Broadcom’s next-generation silicon. Through our ongoing partnership, we remain committed to driving market innovation and consistently delivering top-tier experiences and innovative devices to our global customers,” said Jerry Lee, CEO of Humax Networks.

“We are delighted to collaborate with Broadcom and Samsung to develop our next generation Wi-Fi 8 gateway addressing MSO CBU/FWA market. This solution is capable of delivering a smarter, more secure, and future-ready network optimized solution to meet MSO/FWA customers’ increasing demands of cost competitive 5G NR connectivity,” said Johnson Hsu, SVP & GM of WNC’s Connectivity & Solutions BG.

Availability:

Global carrier trials and OEM sampling of the Samsung B1320 / Broadcom BCM6776 FWA platform are underway.

About Broadcom:

Broadcom Inc. (NASDAQ: AVGO) is a technology leader that designs, develops, and supplies semiconductors and infrastructure software for global organizations’ complex, mission-critical needs. Broadcom combines long-term R&D investment with superb execution to deliver the best technology, at scale. Broadcom is a Delaware corporation headquartered in Palo Alto, CA. For more information, visit www.broadcom.com.

Broadcom, the pulse logo, and Connecting everything are among the trademarks of Broadcom. The term “Broadcom” refers to Broadcom Inc., and/or its subsidiaries. Other trademarks are the property of their respective owners.

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References:

https://www.globenewswire.com/news-release/2026/05/27/3302058/0/en/Broadcom-Unveils-World-s-First-Integrated-5G-and-Wi-Fi-8-FWA-Platform-in-Collaboration-with-Samsung-Electronics.html

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IEEE ComSocSV/SCU SoE New Event (free): Inside a Telecom Chip Start-up and its 4G+5G Base Station SoC

Date & Time: May 30th, 2:30pm to 5pm
Venue: Santa Clara University – SCDI 1308

Register at: https://events.vtools.ieee.org/m/421628

Agenda/Timeline:
⦁ 2:30pm-3pm Registration & Networking
⦁ 3pm Opening Remarks
⦁ 3:05pm-4pm Presentation
⦁ 4pm-4:30pm Panel Discussion/Conversation
⦁ 4:30pm-4:50pm Audience Q & A
⦁ 4:50pm-4:55pm Closing Remarks & Acknowledgements

Abstract:
As 5G evolves for both public and private networks, edge demands will impact the fluidity and constructs of 5G infrastructure. Mobile network operators (public 5G) and enterprises (private 5G) are confronted with a daunting fundamental challenge:

How to deploy a wireless infrastructure that can effortlessly scale across all future upgrades (e.g. 5G Advanced) and demands, without incurring the traditional capital and operating expense of a system redesign and rip-and-replace costs?

This talk will cover the starting point of all wireless infrastructure – the 4G+5G baseband System on a Chip (SoC). We will discuss: how a”soft modem” can scale with evolving infrastructural demands across small cells and macro cells, new application use cases, emerging megatrends (such as 5G non-terrestrial networks), market fundamentals impacting 5G deployments, and personal insights into the starting and evolution of a 5G semiconductor startup company in the era of AI.

 

About EdgeQ:

Five years in the making, EdgeQ emerged in 2018 as one of the very few semiconductor startups [1.] focusing on 5G wireless infrastructure. Led by executives from Qualcomm, Intel, and Broadcom, EdgeQ is pioneering converged connectivity and AI that is fully software-customizable and programmable. The company has raised multiple financing rounds, backed by world-renowned investors across all major continents.  See below for awards EdgeQ has received.

Note 1. There’s been a significant decline in funding for semiconductor startups over the past 10 years due to a maturing industry, high capital requirements, and fewer exits. In 2021, chip startups globally raised $8.3 billion in 263 deals, but in 2023, U.S. startups have only raised $262 million in 17 deals. There have been EVEN FEWER semiconductor startups focusing on wireless telecommunications as EdgeQ has done.

Speakers and Panelists:

  • Adil Kidwai, Head of Product Management, EdgeQ
  • Edward Wu, Head of Marketing & Market Development, EdgeQ

Moderator:  Alan J Weissberger, IEEE Techblog Content Manager, SCU SoE Scholar in Residence, IEEE GCN North American Correspondent

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EdgeQ Awards:

2023 GLOMO Award Winner

References:

https://www.edgeq.io/edgeq-debuts-worlds-first/

https://www.edgeq.io/static/Tech_Pcie_Explosion-f48f32134ee6e58752aab6683a63abf4.mp4

https://techblog.comsoc.org/2024/03/03/edgeq-demos-massive-state-of-the-art-o-ran-based-mimo-solution-at-mwc-2024/

https://techblog.comsoc.org/2021/08/19/edgeq-samples-worlds-1st-software-defined-5g-base-station-on-a-chip/

Samsung and Marvell develop SoC for Massive MIMO and Advanced Radios

Korean electronics giant Samsung Electronics said it has developed a new System-on-Chip (SoC) for its Massive MIMO and other advanced radios in partnership with U.S. chipmaker Marvell. It is expected to be available in Q2 2021 for use in equipment sold to Tier-One network operators.

The SoC is designed to help implement new technologies, which improve cellular radios by increasing their capacity and coverage, while decreasing power consumption and size. The new SoC is equipped to support both 4G and 5G networks simultaneously and aims to improve the capacity and coverage of cellular radios.  It is claimed to save up to 70 percent in chipset power consumption compared to previous solutions.

“We are excited to extend our collaboration with Marvell to unveil a new SoC that will combine both companies’ strengths in innovation to advance 5G network solutions,” said Junehee Lee, Executive Vice President and Head of R&D, Networks Business at Samsung Electronics. “Samsung prioritizes the development of high-impact 5G solutions that offer a competitive edge to our operators. We look forward to introducing this latest solution to the market shortly.”

Samsung and Marvell have been working closely to deliver multiple generations of leading network solutions. Last year, the companies announced a collaboration to develop new 5G products, including innovative radio architectures to address the compute power required for Massive MIMO deployments.

“Our collaboration with Samsung spans multiple generations of radio network products and demonstrates Samsung’s strong technology leadership. The joint effort includes 4G and 5G basebands and radios,” said Raj Singh, Executive Vice President of Marvell’s Processors Business Group. “We are again honored to work with Samsung for the next generation Massive MIMO radios which significantly raise the bar in terms of capacity, performance and power efficiency.”

“Marvell and Samsung are leading the way in helping mobile operators deploy 5G with greater speed and efficiency,” said Daniel Newman, Founding Partner at Futurum Research. “This latest collaboration advances what’s possible through SoC technology, giving operators and enterprises a distinct 5G advantage through optimized performance and power savings in network deployments.”

Samsung has pioneered the successful delivery of 5G end-to-end solutions including chipsets, radios, and core. Through ongoing research and development, Samsung drives the industry to advance 5G networks with its market-leading product portfolio from fully virtualized RAN and Core to private network solutions and AI-powered automation tools. The company is currently providing connectivity to hundreds of millions of users around the world.

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On the network equipment side, Samsung Electronics recently won a 5G contract with Japanese telco NTT DOCOMO, as it seeks to challenge incumbents like Huawei, Ericsson, and Nokia in the telecom equipment business, according to media reports.

In India, Samsung Electronics is likely to apply for a production-linked incentive (PLI) scheme for telecom equipment manufacturing, benefiting from India’s program to locally make 4G and 5G gear and other equipment – for sales both in India and overseas, ET recently reported.

Samsung would then join other global manufacturers such as Cisco, Jabil, Flex and Foxconn, besides European telecom equipment vendors Nokia and Ericsson in applying for the PLI scheme that seeks to boost local production of telecom equipment and reduce imports.

References:

https://news.samsung.com/global/samsung-and-marvell-unveil-new-system-on-a-chip-to-advance-5g-networks

https://telecom.economictimes.indiatimes.com/news/samsung-marvell-develop-soc-for-5g-radios/81720284

https://techblog.comsoc.org/2021/03/23/ntt-docomo-selects-samsung-for-5g-and-o-ran-network-solutions/

Samsung Boosts the Performance of Massive MIMO

Samsung Collaborates With NTT DOCOMO on 5G